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A. K. Stamper
Observed names:
A.K Stamper,
A.K. Stamper,
Anthony K Stamper,
Anthony K. Stamper,
Anthony Stamper
Institution:
GlobalFoundries (United States)
Observed institutions:
IBM (United States),
GlobalFoundries (United States),
GlobalFoundries (Singapore),
Carnegie Mellon University
OpenAlex ID:
A5113582055
Reduced electromigration of Cu wires by surface coating
2002
·
C.-K. Hu
, L. Gignac
, et al.
·
Applied Physics Letters
·
215
Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits
1999
·
D. R. Cote
, S. V. Nguyen
, et al.
·
IBM Journal of Research and Development
·
104
Line edge roughness and spacing effect on low-k TDDB characteristics
2008
·
F. Chen
, J. R. Lloyd
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
49
Single target sputtering of superconducting YBa2Cu3O7−δ thin films on Si (100)
1989
·
M. Migliuolo
, A. K. Stamper
, et al.
·
Applied Physics Letters
·
43
Sub-0.25-micron interconnection scaling: damascene copper versus subtractive aluminum
2002
·
A.K. Stamper
, T.L. McDevitt
, et al.
·
ASMC proceedings
·
42
Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM
1995
·
D. R. Cote
, S. V. Nguyen
, et al.
·
IBM Journal of Research and Development
·
39
Characterization of yttria-stabilized zirconium oxide buffer layers for high-temperature superconductor thin films
1988
·
J-W. Lee
, T. E. Schlesinger
, et al.
·
Journal of Applied Physics
·
39
Planar MEMS RF capacitor integration
2011
·
A. K. Stamper
, C. V. Jahnes
, et al.
·
International Conference on Solid-State Sensors, Actuators and Microsystems
·
29
Plasma-induced gate-oxide charging issues for sub-0.5 μm complementary metal–oxide–semiconductor technologies
1995
·
A. K. Stamper
, J. B. Lasky
, et al.
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
29
Hysteresis model for polycrystalline high-T c superconductors
1988
·
D. D. Stancil
, T. E. Schlesinger
, et al.
·
Journal of Applied Physics
·
18
Advanced wiring RC delay issues for sub-0.25-micron generation CMOS
2002
·
A.K. Stamper
, M.B. Fuselier
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
17
Deposition of textured yttria-stabilized ZrO2 films on oxidized silicon
1991
·
A. K. Stamper
, D. W. Greve
, et al.
·
Journal of Applied Physics
·
17
Characterization of Plasma‐Enhanced Chemical Vapor Deposited Nitride Films Used in Very Large Scale Integrated Applications
1993
·
A. K. Stamper
, S. L. Pennington
·
Journal of The Electrochemical Society
·
16
Low-field structure in the magnetization of polycrystalline YBa2Cu3O7−x and ErBa2Cu3O7−x
1988
·
D. Wong
, A. K. Stamper
, et al.
·
Applied Physics Letters
·
15
A high-resistivity SiGe BiCMOS technology for WiFi RF front-end-IC solutions
2013
·
Alvin Joseph
, Jeff Gambino
, et al.
·
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)
·
14
Electromigration Reliability of Advanced Interconnects
2007
·
C.-K. Hu
, L. M. Gignac
, et al.
·
AIP conference proceedings
·
13
Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
2004
·
R. F. Liu
, C.-K. Hu
, et al.
·
Journal of Applied Physics
·
12
Substrate contamination effects in the processing of chemically amplified DUV photoresists
1994
·
John L. Sturtevant
, Steven J. Holmes
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
9
Plasma charging damage in SOI technology
2002
·
A.C. Mocuta
, T.B. Hook
, et al.
·
International Symposium on Plasma Process-Induced Damage
·
8
Gate dielectric integrity and reliability in 0.5- mu m CMOS technology
1993
·
A.W. Strong
, A.K. Stamper
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
7
Dielectric charging in MEMS with dielectric-dielectric contacts
2013
·
D. Molinero
, C. Shen
, et al.
·
International Conference on Solid-State Sensors, Actuators and Microsystems
·
6
Dual gate oxide charging damage in damascene copper technologies
2002
·
A.K. Stamper
, A. Chou
, et al.
·
International Symposium on Plasma Process-Induced Damage
·
6
Influence of Y2O3ZrO2 buffer layers on sputtered films of YBa2Cu3O6+x
1989
·
D.W Greve
, A.K Stamper
, et al.
·
Materials Science and Engineering A
·
6
High-resistivity SiGe BiCMOS technology development
2014
·
Anthony Stamper
, Renata Camillo-Castillo
, et al.
·
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)
·
5
On-axis sputter deposition of superconducting YBa2Cu3O7-δ on Si(100)
1991
·
A. K. Stamper
, D. W. Greve
, et al.
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
5
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Works count:
37
Citation count:
780
H-index:
14
I10-index:
17
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