Work

Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM

Year: 1995

Type: article

Source: IBM Journal of Research and Development

DOI: 10.1147/rd.394.0437

Authors: D. R. Cote, S. V. Nguyen, W. J. Cote, S. L. Pennington, A. K. Stamper, D. V. Podlesnik

Institutions: IBM (United States), Applied Materials (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2023760293

FWCI: 2.468

Cites: 78

Cited by: 39

Related to: 10