Work

High thermal conductivity underfill study for fine pitch Cu pillar bump

Year: 2013

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2013.6706694

Authors: Huei-Nuan Huang, Mei-Chin Lee, Chi-Tung Yeh, Pai-Yuan Lee, Mu-Hsuan Chan, Chun-Tang Lin, Steve Chiu, Mike Ma

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1999891985

FWCI:

Cites: 4

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Related to: 10