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Chun-Tang Lin
Institution:
Siliconware Precision Industries (Taiwan)
Observed institution:
Siliconware Precision Industries (Taiwan)
OpenAlex ID:
A5111720149
Development and characterization of new generation panel fan-out (P-FO) packaging technology
2014
·
Hong-Da Chang
, David Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
57
Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections
2011
·
Chien-Feng Chan
, Wen-Tsung Tseng
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
13
Effects of cleaning process on the reliability of ultra-fine gap for 3D package
2015
·
Mu-Hsuan Chan
, Brock Hsue
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
2013
·
Mu-Hsuan Chan
, Yi-Chian Liao
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
A study on the 3DIC interconnection using thermal compression bond with non conductive paste process
2012
·
Mu-Hsuan Chan
, Huei-Nuan Huang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Processing TSV wafer with stealth dicing technology
2012
·
Wan-Ting Chen
, Mei-Chin Lee
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Detection of micro defects in 3dic packages by means of non-destructive 3D X-ray
2012
·
Mei-Chin Lee
, Wan-Ting Chen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
4
Study of underfill material for fine pitch Cu pillar bump
2011
·
Huei-Nuan Huang
, Yi-Chian Liao
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
Heat-resistance study of thermal release tape
2013
·
Chieh-Yuan Chi
, Chun-Tang Lin
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Low residue flux for 3D-IC u-bump stacking
2014
·
Yi-Chian Liao
, Jung-Pang Huang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
High thermal conductivity underfill study for fine pitch Cu pillar bump
2013
·
Huei-Nuan Huang
, Mei-Chin Lee
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Effective 3DIC chip module warpage with UF design by analytical method
2013
·
Pai-Yuan Lee
, Chi-Tung Yeh
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Reliability of thermal compression bond combine with non conductive paste process in fine pitch micro-bumps soldering
2011
·
Chien-Feng Chan
, Wen-Tsung Tseng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Works count:
13
Citation count:
100
H-index:
5
I10-index:
2
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