Work

A study on the 3DIC interconnection using thermal compression bond with non conductive paste process

Year: 2012

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2012.6420264

Authors: Mu-Hsuan Chan, Huei-Nuan Huang, Chien-Feng Chan, Chun-Tang Lin, Ming-H. Yang, Jeng Yuan Lai

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2019580557

FWCI: 1.625

Cites: 9

Cited by: 5

Related to: 10