Wafer-scale layer transfer of GaAs and Ge onto Si wafers using patterned epitaxial lift-off
Year: 2015
Type: article
Authors: Eiko Mieda, Tatsuro Maeda, Noriyuki Miyata, Tetsuji Yasuda, Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, Takeshi Aoki, Taketsugu Yamamoto, Osamu Ichikawa, Takenori Osada, Masahiko Hata, Arito Ogawa, Toshiyuki Kikuchi, Yasuo Kunii
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: European Space Agency
OpenAlex ID: W2000675013