Year: 2010
Type: article
Abstract: 0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.
Authors: Soon Jae Yu, Do Hyung Kim
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2005171484