Work

Low-k film damage-resistant CO chemistry-based ash process for low-k/Cu interconnection in flash memory devices

Year: 2009

Type: article

Source: Thin Solid Films

DOI: 10.1016/j.tsf.2009.01.152

Authors: Jeongyun Lee, Wan-Jae Park, Dong-Hwan Kim, Jungdong Choi, Kyoungsub Shin, Ilsub Chung

Institutions: Samsung (South Korea), Samsung Electronics (South Korea), Sungkyunkwan University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2005394360

FWCI: 0.405

Cites: 9

Cited by: 6

Related to: 10