Electrical and Reliability Characteristics of Barrierless Cu-Based Contact for High Dielectric Constant Oxide Thin-Film Device Integration
Year: 2009
Type: article
DOI: 10.1149/1.3242360
Authors: C. H. Wu, J. P. Chu, C. H. Lin, S. F. Wang
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2008304201
