Work

Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry

Year: 2010

Type: article

Source: Thin Solid Films

DOI: 10.1016/j.tsf.2010.11.084

Authors: Vimal K. Kamineni, Pratibha Singh, LayWai Kong, John Hudnall, Jamal Qureshi, Chris Taylor, Andy Rudack, Sitaram Arkalgud, Alain C. Diebold

Institutions: University at Albany, State University of New York, GlobalFoundries (United States), Hewlett-Packard (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Korea Institute of Science and Technology

OpenAlex ID: W2012652243

FWCI: 0.735

Cites: 5

Cited by: 10

Related to: 10