Work

Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

Year: 2012

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-012-2114-6

Authors: Vivek Chidambaram, Ho Beng Yeung, Gao Shan

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Institute of Materials Research and Engineering

OpenAlex ID: W2015304389

FWCI: 4.102

Cites: 7

Cited by: 58

Related to: 10