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Vivek Chidambaram

Observed names: Chidambaram, Vivek, V. Chidambaram
ORCID: 0000-0002-5014-1843
Observed ORCID: 0000-0002-5014-1843
OpenAlex ID: A5085396018
High-temperature lead-free solder alternatives
2010 · Vivek Chidambaram, Jesper Hattel, et al. · Microelectronic Engineering · 194
Development of Au–Ge based candidate alloys as an alternative to high-lead content solders
2009 · Vivek Chidambaram, John Hald, et al. · Journal of Alloys and Compounds · 124
Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system
2010 · Vivek Chidambaram, Jesper Hattel, et al. · Materials & Design (1980-2015) · 98
Dielectric Materials Characterization for Hybrid Bonding
2021 · Vivek Chidambaram, Prayudi Lianto, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 77
Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics
2012 · Vivek Chidambaram, Ho Beng Yeung, et al. · Journal of Electronic Materials · 58
Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging
2012 · Vivek Chidambaram, Xie Ling, et al. · Journal of Electronic Materials · 46
Development of gold based solder candidates for flip chip assembly
2009 · Vivek Chidambaram, John Hald, et al. · Microelectronics Reliability · 31
A corrosion investigation of solder candidates for high-temperature applications
2009 · Vivek Chidambaram, John Hald, et al. · JOM · 28
Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications
2021 · Sharon Pei Siang Lim, Ser Choong Chong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26
Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies
2020 · Vivek Chidambaram, Yew Wing Leong, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 20
Cyanate Ester-Based Encapsulation Material for High-Temperature Applications
2013 · Vivek Chidambaram, Eric Phua Jian Rong, et al. · Journal of Electronic Materials · 18
High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging
2016 · K. Y. Au, Ding Mian Zhi, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 15
Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application
2014 · Vivek Chidambaram, Chen Bangtao, et al. · Journal of Electronic Materials · 15
Non-destructive fault isolation in through-silicon interposer based system in package
2020 · Sajay Bhuvanendran Nair Gourikutty, Kok Keng Chua, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 10
Heterogeneous System Level Integration Using Active Si Interposer
2019 · Vivek Chidambaram, Sharon Lim Pei Siang, et al. · IEEE Journal of the Electron Devices Society · 10
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Novel Solution for High-Temperature Dielectric Application to Encapsulate High-Voltage Power Semiconductor Devices
2018 · Vivek Chidambaram, T. Jing, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 10
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High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors
2017 · Jinghui Xu, Zhipeng Ding, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
High reliability gold based solder alloys for micro-electronics packaging for high temperature applications
2012 · Vivek Chidambaram, Ho Beng Yeung, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 10
Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications
2012 · Vivek Chidambaram, Ho Beng Yeung, et al. · Journal of Electronic Materials · 10
Extreme high pressure and high temperature package development
2013 · Hwang How Yuan, Eva Wai Leong Ching, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 8
High-temperature endurable encapsulation material
2012 · V. Chidambaram, Ho Beng Yeung, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 8
Al-Ge Diffusion Bonding for Hermetic Sealing Application
2015 · Vivek Chidambaram, Sunil Wickramanayaka · Journal of Electronic Materials · 7
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
2009 · Vivek Chidambaram, John Hald, et al. · Journal of Microelectronics and Electronic Packaging · 7
Wafer Level Fusion and Hybrid Bonding: Impact of Critical Process Parameters on Bond Quality
2019 · Vivek Chidambaram, Qin Ren, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Development of high melting point, environmentally friendly solders, using the calphad approach
2008 · Vivek Chidambaram, John Hald, et al. · Technical University of Denmark, DTU Orbit (Technical University of Denmark, DTU) · 5
Works count: 36
Citation count: 871
H-index: 13
I10-index: 19
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