Work

Extreme high pressure and high temperature package development

Year: 2013

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2013.6745746

Authors: Hwang How Yuan, Eva Wai Leong Ching, Chan Yuen Sing, Vivek Chidambaram, Lee Jong Bum, Eric Phua Jian Rong, Gan Chee Lip, Daniel Rhee Min Woo

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics, Nanyang Technological University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2552823136

FWCI: 0.408

Cites: 2

Cited by: 8

Related to: 10