Work

Through Silicon Via stress characterization

Year: 2009

Type: conference-paper

Source: IEEE International Conference on IC Design and Technology (ICICDT)

DOI: 10.1109/icicdt.2009.5166260

Authors: Thuy Dao, Dina H. Triyoso, Mike Petras, Michael Canonico

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2015941345

FWCI: 6.559

Cites: 3

Cited by: 25

Related to: 10