Work

Electromigration in copper damascene interconnects: reservoir effects and failure analysis

Year: 2004

Type: article

Source: Surface and Coatings Technology

DOI: 10.1016/j.surfcoat.2004.10.090

Authors: Wei Shao, A.V. Vairagar, Chih-Hang Tung, Ze-Liang Xie, Ahila Krishnamoorthy, S.G. Mhaisalkar

Institutions: Nanyang Technological University, Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: U.S. Geological Survey

OpenAlex ID: W2016006114

FWCI: 1.194

Cites: 11

Cited by: 31

Related to: 10