Work

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

Year: 2013

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-013-2653-5

Authors: Jenn-Ming Song, Meng-Ju Lin, Kun-Hung Hsieh, Tsung-Yun Pai, Yi-Shao Lai, Ying-Ta Chiu

Institutions: National Chung Hsing University, National Dong Hwa University, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2016124699

FWCI: 1.375

Cites: 27

Cited by: 16

Related to: 10