Work

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

Year: 2012

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2012.08.006

Authors: Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2016268517

FWCI: 0.2

Cites: 4

Cited by: 15

Related to: 10