Work

Low Temperature CVD Route to Binary and Ternary Diffusion Barrier Nitrides for Cu Metallization

Year: 1998

Type: article

Source: MRS Proceedings

DOI: 10.1557/proc-514-499

Authors: Alain E. Kaloyeros, Jean Kelsey, Cindy Goldberg, Dalaver Anjum, Xiaomeng Chen, Jawid Mirza, Kaushik Kumar, Barry Arkles, Bin Han, John J. Sullivan

Institutions: University at Albany, State University of New York, MKS Instruments (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W2016768079

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