Author

Jean E. Kelsey

Observed names: J. E. Kelsey, Jean Kelsey

Institution: University at Albany, State University of New York

Observed institution: University at Albany, State University of New York

OpenAlex ID: A5111662421

Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization

1999 · Jean E. Kelsey, Cindy Goldberg, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 50

On the effect of processing parameters in the chemical-vapor deposition of YBa2Cu3O7−δ thin films on polycrystalline silver

1993 · L. Chen, T. W. Piazza, et al. · Journal of Applied Physics · 15

Vapor phase processing of HTS films for technological application

1992 · Ling Chen, Timothy W. Piazza, et al. · AIP conference proceedings · 2

Chemical vapor deposition of amorphous tungsten nitride for applications in ultra-large scale interconnect technologies

1999 · Jean E. Kelsey · 1

Erratum: “Low temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization” [J. Vac. Sci. Technol. B 17, 1101 (1999)]

1999 · Jean E. Kelsey, Cindy Goldberg, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

Low Temperature CVD Route to Binary and Ternary Diffusion Barrier Nitrides for Cu Metallization

1998 · Alain E. Kaloyeros, Jean Kelsey, et al. · MRS Proceedings

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Works count: 6

Citation count: 68

H-index: 2

I10-index: 2