Work

As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology

Year: 1994

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.186056

Authors: De-Dui Liao, Yih-Shung Lin, Hong Yang, Howard Witham, Javier Saenz, Jeff S. May, Jen-Jiang J. Lee

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2018198247

FWCI:

Cites:

Cited by: 2

Related to: 10