Work

ESD Susceptibility of Thick Film Chip Resistors by Means of Transmission Line Pulsing

Year: 2006

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2006.280125

Authors: D. Bonfert, H. Wolf, H. Gieser, A. Stocker

Institutions: Fraunhofer Institute for Reliability and Microintegration, Fraunhofer-Gesellschaft

Language: English

Topic: Electrostatic Discharge in Electronics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2019128237

FWCI: 2.638

Cites: 12

Cited by: 10

Related to: 10