Author

Detlef Bonfert

Observed names: Bonfert, D., D Bonfert, D. Bonfert, D. C. Bonfert

Observed institutions: Fraunhofer Research Institution for Microsystems and Solid State Technologies, Fraunhofer Institute for Reliability and Microintegration, Fraunhofer-Gesellschaft

OpenAlex ID: A5034824933

InterChip via technology for vertical system integration

2001 · P. Ramm, D. Bonfert, et al. · IEEE International Interconnect Technology Conference (IITC) · 71

3D Integration of CMOS transistors with ICV-SLID technology

2005 · Robert Wieland, Detlef Bonfert, et al. · Microelectronic Engineering · 38

Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis

2016 · C. Landesberger, N. Palavesam, et al. · International Conference on Electronics Packaging (ICEP) · 24

Developing a transient induced latch-up standard for testing integrated circuits

2003 · M. Kelly, L.G. Henry, et al. · Electrical Overstress/Electrostatic Discharge Symposium · 23

Properties of conductive microstructures containing nano sized silver particles

2009 · Jan Felba, Karol Nitsch, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 20

Mechanical Reliability Analysis of Ultra-Thin Chip-on-Foil Assemblies under Different Types of Recurrent Bending

2016 · N. Palavesam, D. Bonfert, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17

FFT based investigations on light flicker in new lighting systems

2016 · Ciprian Ionescu, Mihai Dima, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 11

Investigation of solder joints by thermographical analysis

2009 · Paul Svasta, Ciprian Ionescu, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 11

Transmission Line Pulse Stress on Thick Film Resistors

2007 · D. Bonfert, H. Wolf, et al. · International Spring Seminar on Electronics Technology · 11

Investigations on current capabilities of PEDOT:PSS conductors

2012 · Ciprian Ionescu, Detlef Bonfert, et al. · International Spring Seminar on Electronics Technology · 10

ESD Susceptibility of Thick Film Chip Resistors by Means of Transmission Line Pulsing

2006 · D. Bonfert, H. Wolf, et al. · Electronic System-Integration Technology Conference (ESTC) · 10

Investigations on organic printed resistors based on PEDOT:PSS

2012 · C. Ionescu, P. Svasta, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 8

Electrostatic wafer handling for thin wafer processing

2009 · Christof Landesberger, Robert Wieland, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 8

Flicker distortion power factor analysis in lighting LED's

2017 · Ciprian Ionescu, Mihai Dima, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 7

Electro-thermal analysis of flexible micro-heater

2015 · Aurelian Botau, Detlef Bonfert, et al. · International Spring Seminar on Electronics Technology · 7

Studies on thermal properties of substrates for electronics using IR thermography

2014 · Ciprian Ionescu, Mihai Branzei, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 6

Analytical modeling of contact resistance in organic transistors

2012 · A. Bonea, T. Hassinen, et al. · CAS proceedings · 6

Contact resistance in Polytriarylamine based organic transistors

2011 · Andreea Bonea, Detlef Bonfert, et al. · International Spring Seminar on Electronics Technology · 6

Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics

2010 · Tomasz Falat, Jan Felba, et al. · Electronic System-Integration Technology Conference (ESTC) · 6

Rapid prototyping of electronic modules combining Aerosol printing and Ink Jet printing

2010 · H.A. Gieser, D. Bonfert, et al. · Electronic System-Integration Technology Conference (ESTC) · 6

Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

2015 · Nagarajan Palavesam, Detlef Bonfert, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 5

A SPICE model for electroluminescent foils

2015 · Ciprian Ionescu, Florin Draghici, et al. · International Spring Seminar on Electronics Technology · 4

Investigation on thermal properties of substrates for printed electronics

2014 · Ciprian Ionescu, Detlef Bonfert, et al. · International Spring Seminar on Electronics Technology · 4

Optimization of a heater geometry for flexible gas sensor applications

2013 · Ciprian Ionescu, Detlef Bonfert, et al. · International Spring Seminar on Electronics Technology · 4

Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation

2012 · Krzysztof J. Urbanski, Tomasz Falat, et al. · IEEE International Conference on Nanotechnology (IEEE-NANO) · 4

Works count: 70

Citation count: 362

H-index: 10

I10-index: 11