Work

Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis

Year: 2016

Type: conference-paper

Source: International Conference on Electronics Packaging (ICEP)

DOI: 10.1109/icep.2016.7486872

Authors: C. Landesberger, N. Palavesam, W. Hell, A. Drost, R. Faul, H. Gieser, D. Bonfert, K. Bock, C. Kutter

Institutions: Fraunhofer Research Institution for Microsystems and Solid State Technologies, Technische Universität Dresden

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2412928147

FWCI: 6.045

Cites: 15

Cited by: 24

Related to: 10