3D Integration of CMOS transistors with ICV-SLID technology
Year: 2005
Type: article
Source: Microelectronic Engineering
Authors: Robert Wieland, Detlef Bonfert, Armin Klumpp, Reinhard Merkel, Lars Nebrich, Josef Weber, Peter Ramm
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2111732008