Work

Three years of fine Cu wire bonding in high volume manufacturing

Year: 2011

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2011.6066865

Authors: Bernd K. Appelt, Louie Huang, Yi-Shao Lai, Scott Chen

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2019902180

FWCI: 4.244

Cites: 5

Cited by: 14

Related to: 10