Work

Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization

Year: 2013

Type: conference-paper

Source: International Workshop on Thermal Investigations of ICs and Systems

DOI: 10.1109/therminic.2013.6675188

Authors: M. AboRas, G. Engelmann, D. May, M. Rothermund, R. Schacht, B. Wunderle, H. Oppermann, T. Winkler, S. Rzepka, B. Michel

Institutions: Berliner Nanotest und Design, Fraunhofer Institute for Reliability and Microintegration, Chemnitz University of Technology, Fraunhofer Institute for Electronic Nano Systems

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Bundesministerium für Bildung und Forschung

OpenAlex ID: W2036401331

FWCI: 1.218

Cites: 3

Cited by: 11

Related to: 10