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R. Schacht

Observed names: R Schacht, R.K.B. Schacht, Ralpf Schacht, Ralph Schacht, Schacht, R., Schacht, Ralph, Schacht, Ralph Karl Benjamin
OpenAlex ID: A5111772473
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
2009 · Bernhard Wunderle, K.-F. Becker, et al. · Microsystem Technologies · 47
Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis
2006 · S. Deplanque, W. Nuchter, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 29
Transient thermal response as failure analytical tool - A comparison of different techniques
2013 · D. May, B. Wunderle, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 16
"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
2015 · M. Abo Ras, D. May, et al. · International Workshop on Thermal Investigations of ICs and Systems · 15
Characterization of Thermal Interface Materials to Support Thermal Simulation
2007 · Schacht, R., May, D., et al. · arXiv (Cornell University) · 15
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Accelerated Active High-Temperature Cycling Test for Power MOSFETs
2006 · R. Schacht, B. Wunderle, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 15
Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation
2010 · B. Wunderle, M. Klein, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 14
Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
2014 · Mohamad AboRas, Daniel May, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 13
Pulsed infrared thermal imaging as inline quality assessment tool
2023 · S. Panahandeh, D. May, et al. · Microelectronics Reliability · 12
Accelerated Pump Out Testing for Thermal Greases
2019 · B. Wunderle, D. May, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12
Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
2014 · Mohamad AboRas, Bernhard Wunderle, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12
Transient thermal analysis as failure analytical tool in electronic packaging
2012 · D. May, B. Wunderle, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12
Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization
2013 · M. AboRas, G. Engelmann, et al. · International Workshop on Thermal Investigations of ICs and Systems · 11
Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
2004 · B. Wunderle, R. Schacht, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 11
Efficiency optimization for a frictionless air flow blade fan - Design study
2014 · R.K.B. Schacht, A. Hausdorf, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
2008 · D. May, B. Wunderle, et al. · International Workshop on Thermal Investigations of ICs and Systems · 10
In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
2008 · B. Wunderle, J. Kleff, et al. · International Workshop on Thermal Investigations of ICs and Systems · 10
IR pulse thermography as failure analytical tool applied to die attach processes
2015 · D. May, S. Fritzsche, et al. · International Workshop on Thermal Investigations of ICs and Systems · 9
The "e-Grain" Concept Building Blocks for Self-Sufficient Distributed Microsystems
2004 · M. Jürgen Wolf, Ralph Schacht, et al. · Frequenz · 9
Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
2011 · Mohamad AboRas, R. Haug, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 8
Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
2008 · R. Schacht, B. Wunderle, et al. · Electronic System-Integration Technology Conference (ESTC) · 8
Modelling and characterisation of smart power devices
2012 · B. Wunderle, Mohamad Abo Ras, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 7
Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
2007 · B. Wunderle, T. Braun, et al. · International Workshop on Thermal Investigations of ICs and Systems · 7
Characterization of Thermal Interface Materials
2006 · Ralph Schacht, Daniel May, et al. · Electronic System-Integration Technology Conference (ESTC) · 7
Infrared thermal imaging as inline quality assessment tool
2021 · S. Panahandeh, D. May, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 6
Works count: 77
Citation count: 391
H-index: 12
I10-index: 17
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