Work

Silicon device thinning using preferential polishing: progress in flatness and electrical properties

Year: 1992

Type: article

Source: Semiconductor Science and Technology

DOI: 10.1088/0268-1242/7/1a/047

Authors: S Wada, S Takahashi, Y Hayashi

Institution: NEC (Japan)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2037470751

FWCI:

Cites: 1

Cited by: 1

Related to: 10