Strain distribution in Si capping layers on SiGe islands: influence of cap thickness and footprint in reciprocal space
Year: 2012
Type: article
Abstract: We present investigations on the strain properties of silicon capping layers on top of regular SiGe island arrays, in dependence on the Si-layer thickness. Such island arrays are used as stressors for the active channel in field-effect transistors where the desired tensile strain in the Si channel is a crucial parameter for the performance of the device. The thickness of the Si cap was varied from 0 to 30 nm. The results of high resolution x-ray diffraction experiments served as input to perform detailed strain calculations via finite element method models. Thus, detailed information on the Ge distribution within the buried islands and the strain interaction between the SiGe island and Si cap was obtained. It was found that the tensile strain within the Si capping layer strongly depends on its thickness, even if the Ge concentration of the buried dot remains unchanged, with tensile strains degrading if thicker Si layers are used.
Source: Nanotechnology
Authors: N Hrauda, J J Zhang, M J Süess, E Wintersberger, V Holý, J Stangl, C Deiter, O H Seeck, G Bauer
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $2,523
Funder: Austrian Science Fund
Award: G611302229
OpenAlex ID: W2046367176