Lead (Pb)-free solders for electronic packaging
Year: 1994
Type: article
Source: Journal of Electronic Materials
DOI: 10.1007/bf02651362
Authors: Sung K. Kang, Amit K. Sarkhel
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2051246071