Author

Sung K. Kang

Observed names: Sung Kang, Sung Kwan Kang, Sung Kyu Kang, Sung-Kwan Kang, Sungkwan Kang

Observed institutions: IBM (United States), Chosun University, Inha University, Yonsei University, Samsung (South Korea), IBM Research - Thomas J. Watson Research Center, Yonsei University Health System, Samsung Advanced Institute of Technology (South Korea), Yonsei University Mirae Campus, Carnegie Mellon University, Gwangju University, Stanford University

OpenAlex ID: A5111811639

Lead (Pb)-free solders for electronic packaging

1994 · Sung K. Kang, Amit K. Sarkhel · Journal of Electronic Materials · 333

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

2004 · Donald W. Henderson, James J. Woods, et al. · Journal of materials research/Pratt's guide to venture capital sources · 202

Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

2002 · Donald W. Henderson, Timothy Gosselin, et al. · Journal of materials research/Pratt's guide to venture capital sources · 200

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

2003 · Sung K. Kang, Da-Yuan Shih, et al. · JOM · 172

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

2004 · Sung K. Kang, Da-Yuan Shih, et al. · JOM · 158

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

2007 · Moon Gi Cho, Sung K. Kang, et al. · Journal of Electronic Materials · 138

Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

2006 · Sung K. Kang, Donovan Leonard, et al. · Journal of Electronic Materials · 107

Color Based Hand and Finger Detection Technology for User Interaction

2008 · Sung Kwan Kang, Mi Young Nam, et al. · International Conference on Hybrid Information Technology (ICHIT) · 92

Oxidation study of pure tin and its alloys via electrochemical reduction analysis

2005 · Sungil Cho, Jin Yu, et al. · Journal of Electronic Materials · 89

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

2008 · Sun-Kyoung Seo, Sung K. Kang, et al. · Journal of Electronic Materials · 82

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

2009 · Sun-Kyoung Seo, Sung K. Kang, et al. · Microelectronics Reliability · 80

Development of conducting adhesive materials for microelectronic applications

1999 · Sung K. Kang, S. Purushothaman · Journal of Electronic Materials · 62

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

2009 · Sun-Kyoung Seo, Sung K. Kang, et al. · Journal of Electronic Materials · 61

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

2004 · Sung K. Kang, Paul Lauro, et al. · MATERIALS TRANSACTIONS · 48

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Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders

2003 · Paul Lauro, Sung K. Kang, et al. · Journal of Electronic Materials · 47

Undercooling and microhardness of Pb-free solders on various under bump metallurgies

2008 · Moon Gi Cho, Sung K. Kang, et al. · Journal of materials research/Pratt's guide to venture capital sources · 40

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

2007 · Sung K. Kang, M.G. Cho, et al. · Journal of materials research/Pratt's guide to venture capital sources · 39

Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process

2007 · Sung K. Kang, Moon Gi Cho, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 39

Effect of Zn doping on SnAg solder microstructure and electromigration stability

2009 · Minhua Lu, Da-Yuan Shih, et al. · Journal of Applied Physics · 32

Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors

1977 · Sung Kang, N. Zommer, et al. · IEEE Transactions on Parts Hybrids and Packaging · 30

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

2010 · Sun-Kyoung Seo, Sung K. Kang, et al. · JOM · 23

Recent progress in Pb-free solders and soldering technologies

2001 · Sung K. Kang · JOM · 23

Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

2009 · Moon Gi Cho, Sung K. Kang, et al. · Journal of Electronic Materials · 22

An overview of Pb-free, flip-chip wafer-bumping technologies

2008 · Sung K. Kang, Peter Gruber, et al. · JOM · 22

Dissolution kinetics of nickel in liquid tin

1981 · Sung K. Kang · Metallurgical Transactions B · 21

Works count: 75

Citation count: 2,410

H-index: 22

I10-index: 36