Work

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Year: 2003

Type: article

Source: JOM

DOI: 10.1007/s11837-003-0143-6

Authors: Sung K. Kang, Da-Yuan Shih, NY. Donald, W. Henderson, Timothy Gosselin, Amit Sarkhel, NY. Charles Goldsmith, Karl J. Puttlitz, Won Kyoung Choi

Institutions: IBM Research - Thomas J. Watson Research Center, IBM (United States), Samsung (South Korea), Samsung Advanced Institute of Technology (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2201628125

FWCI: 8.274

Cites: 11

Cited by: 172

Related to: 10