Work

Reliability study of lead-free flip-chips with solder bumps down to 30 μm diameter

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6248889

Authors: Stefan Harter, Rainer Dohle, Andreas Reinhardt, Jorg Gosler, Jorg Franke

Institutions: Friedrich-Alexander-Universität Erlangen-Nürnberg, Micro Systems Engineering (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2052490540

FWCI: 0.405

Cites: 19

Cited by: 4

Related to: 10