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Andreas Reinhardt

Observed names: A. Reinhardt, Reinhardt, Andreas
ORCID: 0000-0001-5907-845X
Observed ORCID: 0000-0001-5907-845X
OpenAlex ID: A5035894050
Investigation of fiber motion near solid boundaries in simple shear flow
2001 · Kelli B. Moses, Suresh G. Advani, et al. · Rheologica Acta · 91
Capability of biopolymers in electronics manufacturing
2012 · Rene Schramm, Andreas Reinhardt, et al. · International Spring Seminar on Electronics Technology · 36
Optimized thin-film diffusion soldering for power-electronics production
2013 · Aarief Syed Khaja, Christopher Kaestle, et al. · International Spring Seminar on Electronics Technology · 35
A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing
2020 · Nils Thielen, Dominik Werner, et al. · International Spring Seminar on Electronics Technology · 25
Preliminary Study on Composite Hip Prostheses Made by Resin Transfer Molding
1999 · Andreas Reinhardt, Suresh G. Advani, et al. · Journal of Composite Materials · 14
Investigations on ultrasonic copper wire wedge bonding for power electronics
2013 · Christopher Kaestle, Aarief Syed Khaja, et al. · International Spring Seminar on Electronics Technology · 13
Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering
2022 · Reinhardt Seidel, Thomas Ahrens, et al. · Microelectronics Reliability · 10
Reliability of molded interconnect devices (MID) protected by encapsulation methods overmolding, potting and coating
2012 · Christian Goth, Jorg Franke, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 9
Fracture Toughness of Discontinuous Long Glass Fiber Reinforced Polypropylene: An Approach Based on a Numerical Prediction of Fiber Orientation in Injection Molding
2005 · V. Rizov, T. Harmia, et al. · Polymers and Polymer Composites · 8
Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
2021 · Nils Thielen, Zonghan Jiang, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 5
Reliability of micromechatronic systems with chip on molded interconnected devices and flexible substrates
2010 · A. Reinhardt, J. Franke, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Reliability study of lead-free flip-chips with solder bumps down to 30 μm diameter
2012 · Stefan Harter, Rainer Dohle, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Self-Heating Printed Circuit Board - A Challenge to Contact and Control for a Reflow Soldering Process
2018 · Arne Neiser, Dirk Seehase, et al. · International Spring Seminar on Electronics Technology · 3
Control a Joule-Heating Embedded Layer within a Printed Circuit Board
2018 · Arne Neiser, Dirk Seehase, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Experimental characterization and finite element analysis of thermo-mechanical stress in flip-chip- and wirebond-assemblies on flexible and injection molded thermoplastic substrates
2012 · C. Goth, A. Reinhardt, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Auswahlleitfaden für Montagelösungen in der Leistungselektronik
2008 · Michael Pfeffer, Andreas Reinhardt, et al. · Springer eBooks · 2
Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter
2012 · Rainer Dohle, Stefan Härter, et al. · IMAPSource Proceedings · 1
Improvement of Measurement Devices for Soldering Machines
2021 · Alexander Herkert, Arne Neiser, et al. · International Spring Seminar on Electronics Technology
The Challenge of a Self-Soldering PCB
2019 · Arne Neiser, Dirk Seehase, et al. · European Microelectronics and Packaging Conference
Wireless Sensor Nodes Optimized for Industrial Soldering Equipment
2019 · Arne Neiser, Melanie Abb, et al. · International Spring Seminar on Electronics Technology
Plasma Based Voc-Free Fluxing for Selective and Wave Soldering
2015 · Andreas Reinhardt, Sonja Wege · SMTA International
Ressourceneffiziente Prozess- und Produktionstechnologie für flexible Schaltungsträger
2014 · Reinhardt, Andreas · OPUS Repository (Kooperativer Bibliotheksverbund Berlin-Brandenburg)
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Schlusswort
2008 · Michael Pfeffer, Andreas Reinhardt · Springer eBooks
Einleitung
2008 · Klaus Feldmann, Andreas Reinhardt, et al. · Springer eBooks
Characterization of Rheology and Prediction of Three-dimensional Fiber Orientation during Injection Molding of Long Glass Fiber Reinforced Polypropylene
2002 · Andreas Reinhardt · Publication Server of Kaiserslautern University of Technology (Kaiserslautern University of Technology)
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Works count: 25
Citation count: 265
H-index: 8
I10-index: 7
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