Work

The Challenge of a Self-Soldering PCB

Year: 2019

Type: conference-paper

Source: European Microelectronics and Packaging Conference

DOI: 10.23919/empc44848.2019.8951814

Authors: Arne Neiser, Dirk Seehase, Andreas Reinhardt

Institution: University of Rostock

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3000366704

FWCI:

Cites: 4

Cited by:

Related to: 10