Work

Reliability of micromechatronic systems with chip on molded interconnected devices and flexible substrates

Year: 2010

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2010.5702610

Authors: A. Reinhardt, J. Franke, C. Goth

Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Allianz Industrie Forschung, Bundesministerium für Wirtschaft und Technologie

OpenAlex ID: W2129487289

FWCI: 0.854

Cites: 6

Cited by: 5

Related to: 10