Work

Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe package

Year: 2008

Type: article

Source: Microsystem Technologies

DOI: 10.1007/s00542-008-0713-1

Authors: Nansen Chen, Hongchin Lin

Institutions: National Chung Hsing University, MediaTek (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science Council, MediaTek

OpenAlex ID: W2053731344

FWCI:

Cites: 3

Cited by: 1

Related to: 10