Work

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Year: 2009

Type: article

Abstract: This study evaluated mechanical behavior of the intermetallic compounds (IMCs) formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the wires of Cu and Ag under different loading rates. Compared to Ag based IMCs, Cu based IMCs were harder and stiffer, but less strain rate sensitive. The morphology of the indent impression was found depending on the ratio of the modulus to hardness, and the crystal structure of the IMCs.

Source: MATERIALS TRANSACTIONS

DOI: 10.2320/matertrans.m2009016

Authors: Jenn-Ming Song, Yu-Lin Shen, Chien-Wei Su, Yi-Shao Lai, Ying-Ta Chiu

Institutions: National Dong Hwa University, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

Funder: National Science Council

OpenAlex ID: W2058769059

FWCI: 1.289

Cites: 10

Cited by: 41

Related to: 10