Full-chip lithography manufacturability check for yield improvement
Year: 2006
Type: conference-paper
DOI: 10.1117/12.656401
Authors: Yongfa Huang, Edward Tseng, Benjamin Szu-Min Lin, Chun Chi Yu, Chien-Ming Wang, Hua-Yu Liu
Institution: United Microelectronics (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2079868397
