Work

Ultra low-k porous silicon dioxide films from a plasma process

Year: 2001

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2001.930050

Authors: Qingyan Han, Wei Chen, C. Waldfried, O. Escorcia, N.M. Sbrockey, T.J. Bridgewater, E.S. Moyer, I. Berry

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2095743883

FWCI: 1.192

Cites: 3

Cited by: 3

Related to: 10