Get started
Author

Orlando Escorcia

Observed name: O. Escorcia
ORCID: 0009-0006-6640-1861
Observed ORCID: 0009-0006-6640-1861
OpenAlex ID: A5048119024
The effect of Ta on the magnetic thickness of permalloy (Ni81Fe19) films
2000 · M. Kowalewski, W. H. Butler, et al. · Journal of Applied Physics · 75
Thin film processing by biased target ion beam deposition
2000 · T.L. Hylton, B. Ciorneiu, et al. · IEEE Transactions on Magnetics · 37
Cleaning Solutions for p-MSQ Low-k Device Applications
2003 · C. Waldfried, O. Escorcia, et al. · Electrochemical and Solid-State Letters · 24
PDF
Damage of Low-k and Ultralow-k Dielectrics from Reductive Plasma Discharges Used for Photoresist Removal
2005 · Darren L. Moore, Richard J. Carter, et al. · Journal of The Electrochemical Society · 23
PDF
Plasma Impacts to an O-SiC Low-k Barrier Film
2004 · Wei Chen, Qingyuan Han, et al. · Journal of The Electrochemical Society · 17
Activated He:H2 Strip of Photoresist over Porous Low-k Materials
2005 · Qing Yuan Han, Brian White, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 15
Photoresist strip challenges for advanced lithography at 20nm technology node and beyond
2012 · Ivan L. Berry III, Carlo Waldfried, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10
Role of dielectric and barrier integrity in reliability of sub-100 nm copper low-k interconnects
2005 · Zs. Tokei, J. Van Aelst, et al. · IEEE International Reliability Physics Symposium proceedings · 8
Evaluation of Plasma Strip Induced Substrate Damage
2009 · Ke Ping Han, S. Luo, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 7
Comparison of Curing Processes for Porous Dielectrics
2004 · Ronald C. Hedden, Carlo Waldfried, et al. · Journal of The Electrochemical Society · 7
PDF
Single wafer RapidCuring/spl trade/ of porous low-k materials
2003 · C. Waldfried, Qingyuan Han, et al. · IEEE International Interconnect Technology Conference (IITC) · 5
Study of Controlled Oxygen Diffusion Approaches for Advanced Photoresist Strip
2012 · Shi Jian Luo, Orlando Escorcia, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
Improved low-k dielectric properties using He/H2 plasma forresist removal
2008 · Adam Urbanowicz, Denis Shamiryan, et al. · 3
Ultra low-k porous silicon dioxide films from a plasma process
2001 · Qingyan Han, Wei Chen, et al. · IEEE International Interconnect Technology Conference (IITC) · 3
Study of Alternative Plasma Strip Techniques for Advanced Photoresist Removal
2010 · Shijian Luo, Orlando Escorcia, et al. · ECS Transactions · 2
PDF
UV Curing Effects of Low-k Materials under Reactive Conditions
2008 · Darren Moore, Carlo Waldfried, et al. · MRS Proceedings · 2
Effluent Management for Non-Oxidizing Plasma Strip Processes
2011 · Shijian Luo, Carlo Waldfried, et al. · ECS Transactions · 1
Thin film processing by biased target ion beam deposition
2005 · T.L. Hylton, D. Baldwin, et al. · IEEE International Magnetics Conference
Activated He:H2 Strip of Photoresist over Porous Low-k Materials
2005 · Qing Yuan Han, Brian White, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
UV-assisted curing: an effective technique for toughening of low-k organosilicate films
2005 · Francesca Iacopi, Carlo Waldfried, et al.
Works count: 21
Citation count: 243
H-index: 8
I10-index: 7
Year
Topic
Type