Work

Direct wafer bonding of atomic layer deposited TiO2 and Al2O3 thin films

Year: 2011

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/transducers.2011.5969474

Authors: R. L. Puurunen, T. Suni, O. Ylivaara, H. Kondo, M. Ammar, T. Ishida, H. Fujita, A. Bosseboeuf, S. Zaima, H. Kattelus

Institutions: VTT Technical Research Centre of Finland, Institute of Industrial Science, The University of Tokyo, The University of Tokyo, Nagoya University, Université Paris-Sud, Centre National de la Recherche Scientifique

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2099656129

FWCI: 1.271

Cites: 3

Cited by: 7

Related to: 10