Author

Tommi Suni

Observed names: Suni Tommi, Suni, T., Suni, Tommi, T. Suni

Observed institutions: Picosun (Finland), Institute of Industrial Science, The University of Tokyo, The University of Tokyo, VTT Technical Research Centre of Finland

OpenAlex ID: A5000279158

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]

2002 · T. Suni, K. Henttinen, et al. · Journal of The Electrochemical Society · 342

Wafer-level SLID bonding for MEMS encapsulation

2013 · H. Xu, T. Suni, et al. · Advances in Manufacturing · 44

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MEMS on cavity-SOI wafers

2007 · Hannu Luoto, Kimmo Henttinen, et al. · Solid-State Electronics · 34

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

2005 · T. Suni, K. Henttinen, et al. · Journal of The Electrochemical Society · 23

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A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks

2013 · David Ruffieux, Nicola Scolari, et al. · IEEE Journal of Solid-State Circuits · 20

Comparison of thermally and mechanically induced Si layer transfer in hydrogen-implanted Si wafers

2003 · T. Höchbauer, A. Misra, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 20

Direct wafer bonding for MEMS and microelectronics

2006 · Tommi Suni · Aaltodoc (Aalto University) · 19

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Cold ion-cutting of hydrogen implanted Si

2002 · K. Henttinen, T. Suni, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 18

Reducing stiction in microelectromechanical systems by rough nanometer-scale films grown by atomic layer deposition

2012 · R.L. Puurunen, A. Häärä, et al. · Sensors and Actuators A Physical · 17

Depth profiling of Al2O3+ TiO2 nanolaminates by means of a time-of-flight energy spectrometer

2011 · M. Laitinen, T. Sajavaara, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 15

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Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

2012 · R.L. Puurunen, T. Suni, et al. · Sensors and Actuators A Physical · 14

Silicon-on-Insulator Wafers with Buried Cavities

2006 · T. Suni, K. Henttinen, et al. · Journal of The Electrochemical Society · 14

Characterization of low-temperature processed single-crystalline silicon thin-film transistor on glass

2003 · Xuejie Shi, K. Henttinen, et al. · IEEE Electron Device Letters · 14

Silicon layer transfer using plasma hydrogenation

2005 · Peng Chen, S. S. Lau, et al. · Applied Physics Letters · 12

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

2016 · Charles-Alix Manier, Kai Zoschke, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 11

Wafer level packaging for hermetical encapsulation of MEMS resonators

2015 · Charles-Alix Manier, Kai Zoschke, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 10

Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS

2014 · H. Xu, A. Rautiainen, et al. · Electronic System-Integration Technology Conference (ESTC) · 10

Bonding of ALD Alumina for Advanced SOI Substrates

2010 · Tommi Suni, Riikka L. Puurunen, et al. · ECS Transactions · 10

Wafer-level AuSn and CuSn bonding for MEMS encapsulation

2013 · Tommi Suni, Hongbo Xü, et al. · 9

Characterization of bonded interface by HF etching method

2003 · Tommi Suni, Jyrki Kiihamäki, et al. · 9

Thick-film silicon-on-insulator wafers preparation and properties

2020 · Jari Mäkinen, Tommi Suni · Elsevier eBooks · 8

Nondestructive Characterization of Fusion and Plasma Activated Wafer Bonding Using Mesa and Recess Structures

2014 · Aapo Varpula, Tommi Suni, et al. · ECS Journal of Solid State Science and Technology · 8

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Direct wafer bonding of atomic layer deposited TiO2 and Al2O3 thin films

2011 · R. L. Puurunen, T. Suni, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 7

Silicon Direct Bonding

2015 · Kimmo Henttinen, Tommi Suni · Elsevier eBooks · 6

Direct Bonding of Thick Film Polysilicon to Glass Substrates

2006 · H. Luoto, T. Suni, et al. · Journal of The Electrochemical Society · 6

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Works count: 65

Citation count: 775

H-index: 13

I10-index: 18