Work

Room temperature electroless plating copper seed layer process for damascene interlevel metal structures

Year: 2000

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/s0167-9317(99)00317-2

Authors: Joseph P O’Kelly, Karen F Mongey, Yveline Gobil, Joaquin Torres, Patrick V Kelly, Gabriel M Crean

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2102984992

FWCI: 2.596

Cites: 8

Cited by: 55

Related to: 10