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Robust Cu Dual Damascene Interconnects With Porous SiOCH Films Fabricated by Low-Damage Multi-Hard-Mask Etching Technology

Year: 2006

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2006.883593

Authors: H. Ohtake, M. Tagami, M. Tada, M. Ueki, M. Abe, S. Saito, F. Ito, Y. Hayashi

Institutions: Tohoku University, Institute of Fluid Science, Tohoku University, NEC (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2103560005

FWCI: 0.545

Cites: 23

Cited by: 11

Related to: 10