Work

Study of TLC application for 1 Mbit embedded non-overlapped implantation NVM

Year: 2015

Type: conference-paper

Source: International Conference on Informatics, Electronics & Vision (ICIEV)

DOI: 10.1109/iciev.2015.7334015

Authors: S.W. Chou, H.X. Chen, C.H. Wu, M.T. Lin, E.S. Jeng

Institution: Chung Yuan Christian University

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2121178490

FWCI:

Cites: 6

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Related to: 10