Work

Novel Method for Simultaneous Formation of Wires and Vias of a Printed Circuit Board Using Nanoporous Body

Year: 2006

Type: article

Source: IEEE Transactions on Advanced Packaging

DOI: 10.1109/tadvp.2006.871186

Authors: K. Asakawa, S. Matake, Y. Hotta, T. Hiraoka

Institution: Toshiba (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2128307441

FWCI: 0.328

Cites: 8

Cited by: 2

Related to: 10