Work

Moisture diffusion model verification of packaging materials

Year: 2008

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2008.4607066

Authors: Xiaosong Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q. Zhang, Charles Regard, Christian Gautier, Helene Fremont

Institutions: Delft University of Technology, NXP (Netherlands), Université de Bordeaux, Laboratoire de l'Intégration du Matériau au Système, Université de Caen Normandie

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2129249605

FWCI: 1.895

Cites: 6

Cited by: 15

Related to: 10