Work

Effect of passivation on stress relaxation in electroplated copper films

Year: 2006

Type: article

Source: Journal of materials research/Pratt's guide to venture capital sources

DOI: 10.1557/jmr.2006.0196

Authors: Dongwen Gan, Paul S. Ho, Yaoyu Pang, Rui Huang, Jihperng Leu, Jose Maiz, Tracey Scherban

Institutions: The University of Texas at Austin, Intel (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Intel Corporation

OpenAlex ID: W2164084367

FWCI: 1.275

Cites: 20

Cited by: 47

Related to: 10