Work

A study of the effects of BGA solder geometry on fatigue life and reliability assessment

Year: 2002

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm.1998.689550

Authors: Q. Yu, M. Shiratori, Y. Ohshima

Institution: Yokohama National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2170625152

FWCI: 4.13

Cites: 6

Cited by: 36

Related to: 10